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 TDE3237
INTELLIGENT POWER SWITCH
ADVANCE DATA
HIGH OUTPUT CURRENT ADJUSTABLE SHORT-CIRCUIT PROTECTION INTERNAL THERMAL PROTECTION WITH HYSTERESIS TO AVOID THE INTERMEDIATE OUTPUT LEVELS LARGE SUPPLY VOLTAGE RANGE: 8 TO 30V
Minidip SO14
DESCRIPTION The TDE3237 is a monolithic amplifier designed for high-current and high-voltage applications, specIally to drive lamps, relays and stepping motors. The device is essentially blow-out proof. Current limiting is available to limit the peak output current to a safe value, the adjustment only requires one external resistor. In addition, thermal shut down is provided to keep the IC from overheating. If external dissipation becomes too great, the driver will PIN CONNECTIONS
ORDERING NUMBERS: TDE3237DP TDE3237FP
shut down to prevent excessive heating. The output is also protected from short-circuits with the positive power supply. The device operates over a wide range of supply voltages from standard 15V operational amplifier supplies down to the single 12V or 24V used for industrial electronic systems.
Minidip
SO14
November 1991
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This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice. T is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without
TDE3237
ABSOLUTE MAXIMUM RATINGS
Symbol VCC VID VI IO Ptot Tstg Toper Supply Voltage Differantial Input Voltage Input Voltage Output Current Power Dissipation Storage Temperature Range Operating Free-air Temperature Range Parameter Value 36 36 36 500 Internally Limited - 65 to + 150 - 25 to + 85 Unit V V V mA W C C
THERMAL CHARACTERISTICS
Symbol R th(j-c) R th(j-a) Parameter Maximum Junction-case Thermal Resistance (note 1) Maximum Junction-ambient Thermal Resistance (note 1) Junction-ceramic Substrate (case glued to substrate) Junction-ceramic Substrate (case glued to substrate, substrate temperature maintened constant)
Note : 1. Devices bonded on 40 cm glass-epoxy printed circuit 0.15cm thick with 4cm of copper
2
Value Minidip Minidip SO14 SO14 50 120 90 65
Unit C/W C/W C/W C/W
SCHEMATIC DIAGRAM
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TDE3237
ELECTRICAL CHARACTERISTICS Tamb = - 25 to +85 C, VCC = 8 to 30 V, unless otherwise specified (note 1).
Symbol VIO IIB ICC VCM ISC VCC-V O IOL
Notes : 2) For operating at high temperature, the TDE3237, must be derated based on a + 150 C maximum junction temperature and a junction-ambient thermal as showed in the thermal characteristics data base. 3) The offset voltage given is the maximum value of input voltage required to drive the output voltage within 2 V of the ground or the supply voltage.
Parameter Input Offset Voltage - (note 3) Input Bias Current Supply Current (VCC = + 24 V, IO = 0) Common-mode Input Voltage Range Short-circuit Current Limit (Tcase = + 25 C, RSC = 3.3 ) Output Saturation Voltage (output high) (RSC = 0, VI+-VI- 50 mV, IO = 150 mA Low Level Output Current (VO = VCC = + 24 V Tamb = + 25 C)
Min. - - - 2 - - -
Typ. 2 0.1 3 - 230 1 -
Max. 50 1.5 5 VCC-2 - 1.5 100
Unit mV A mA V -mA V A
SIMPLIFIED SCHEMATIC
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TDE3237
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TDE3237
SO14 PACKAGE MECHANICAL DATA
DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F L M S 3.8 0.4 8.55 5.8 1.27 7.62 4.0 1.27 0.68 8 (max.) 0.15 0.016 8.75 6.2 0.35 0.19 0.5 45 (typ.) 0.336 0.228 0.050 0.300 0.157 0.050 0.027 0.344 0.244 0.1 mm TYP. MAX. 1.75 0.25 1.6 0.46 0.25 0.014 0.007 0.020 0.004 MIN. inch TYP. MAX. 0.069 0.009 0.063 0.018 0.010
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TDE3237
MINIDIP PACKAGE MECHANICAL DATA
DIM. MIN. A a1 B b b1 D E e e3 e4 F I L Z 3.18 7.95 2.54 7.62 7.62 6.6 5.08 3.81 1.52 0.125 0.51 1.15 0.356 0.204 1.65 0.55 0.304 10.92 9.75 0.313 0.100 0.300 0.300 0.260 0.200 0.150 0.060 mm TYP. 3.32 0.020 0.045 0.014 0.008 0.065 0.022 0.012 0.430 0.384 MAX. MIN. inch TYP. 0.131 MAX.
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TDE3237
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A.
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